#散熱 #CoWoS #台積電 #3D封裝 #載板
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CoWoS除了使用中介層、矽穿孔、RDL、Ubump等關鍵技術與零件帶旺相關供應鏈，也帶動生產相關零件的設備供應商業績水漲船高。
AI帶動的硬體元件升級廣泛，CoWoS則是與AI GPU密不可分，根據研究預估，CoWoS產能供不應求將至少持續至2025年，等同協力廠商的訂單能見度至少看至一年以後。
CoWoS製程還需使用哪些半導體、電子零組件？就讓 半導體專家 林嘉洤 教授，和金融行銷專家 馬瑞辰 教授 在這集影片告訴你！
In addition to using key technologies and parts such as interposers, silicon vias, RDL, and Ubump to boost related supply chains, CoWoS has also driven up the performance of equipment suppliers that produce related parts.
AI-driven hardware component upgrades are widespread, and CoWoS is inseparable from AI GPUs. According to research estimates, CoWoS production capacity will be in short supply until at least 2025, which means that the visibility of orders from third parties will be at least one year later.
What other semiconductors and electronic components are needed for the CoWoS process? Let semiconductor expert Professor Lin Jiatong and financial marketing expert Professor Ma Ruichen tell you in this video!
【先進封裝供應鏈】Advanced packaging supply chain
【上游】設備供應商/載板/探針/中介層 Upstream(Equipment suppliers / substrates / probes / interposers)
萬潤(6187)、弘塑(3131)、新耘(3583)、均華(6640)、
均豪(5443)、志聖(2467)、致茂(2360)、欣興(3037)、
雍智(6683)、旺矽(6223)、精測(6510)、穎崴(6515)、
聯電(2303)
【中游】封裝 Midstream(Packaging)
台積電(2330)、日月光(3711)、台星科(3265)
【下游】：測試 Downstream(Testing)
京元電(2449)、矽格(6257)
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26 окт 2024
