Bonding with TPT's automatic Wire Bonder HB100: ball bonding, wedge bonding, bump bonding, ribbon bonding and in manual mode on different bonding heights. For more information visit: www.tpt-wirebonder.com/hb100/
The video shows 25µm ball bonding. The user interface is English - you are very welcome to contact our Chinese sales representative for more information about usability: www.befirst-tech.com/
Dear Waleri, the welding is done via ultrasonic force and pressure. Sometimes it helps to heat the substrate, but only low temperatures are applied (up to 250°C).