Hello, I had some doubts. If possible can you please explain. 1) How do i validate the design after finding the temperature distribution of heatsink? I still dont know the optimal junction to heatsink surface temperature resistance, so i think i cant be sure if that particular heatsink will be good or bad for a given Chip. 2) are we supposed to give an experimental guess to film co efficient, what if that value is very far from the actual one in reality ? due to a variety of reasons. Thanks in advance
Take a look at this video and let me know if it helps: ru-vid.com/video/%D0%B2%D0%B8%D0%B4%D0%B5%D0%BE-z-ap8hFfjK8.htmlsi=1MhtUR1h4wMYSU0O Please note that my tutorials are intended for educational purposes only. Ensure you apply the necessary scientific approach in real-world applications.
Hi, this simulation was done through the workbench mechanical designer ryt? So what is the difference of the simulation we do it in ANSYS CFD solver by defining boundary conditions, and a turbulence model, and defining solver settings?
Here's an analogy: Imagine designing a bridge. Workbench Mechanical Designer is like a simple stress calculator, telling you if the bridge beams can support a certain weight. ANSYS CFD Solver is like a wind tunnel simulator, allowing you to analyze how wind affects the entire bridge structure in detail. Choosing the right tool depends on the complexity of your simulation needs. For basic structural analysis, Workbench Mechanical Designer might suffice. For in-depth analysis of fluid flow and related phenomena, ANSYS CFD Solver is the more powerful option.
