IBL introduce the Vacuum 745 vapor phase soldering system. Developed to outgas voids in BGAs and other bottom-terminated devices. The board remain in one place within the chamber while it uses vapor phase to bring the board up to peak reflow temperature. The vacuum system is then brought in from the side and evacuates all the air out of the chamber. This novel system can achieve zero voiding when combined with compatible flux chemistries.
14 окт 2024
