An Introduction to Electronics Systems Packaging by Prof. G.V. Mahesh, Department of Electronic system Engineering, IISc Bangalore.For more details on NPTEL visit nptel.iitm.ac.in
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4 июл 2012
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Комментарии : 13
4 года назад
This is the best video i find about thermal profiles
Hey, I think there's a mistake. At the right side you take some notes concerning the eutectic point. It has to be 63:37 - Pb:Sn according to your phase diagram. However, you speak of 63:37 - Sn:Pb in your shear strength diagram?!?
Mistake at 33:02 - He said the percentage tin is 3% and that's wrong. The percentage tin is 96.5%, percentage of silver is 3% and percentage of copper is 0.5%.