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Mod-07 Lec-37 Tin-lead and lead-free solders,Phase diagrams,Thermal profiles for reflow soldering 

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An Introduction to Electronics Systems Packaging by Prof. G.V. Mahesh, Department of Electronic system Engineering, IISc Bangalore.For more details on NPTEL visit nptel.iitm.ac.in

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4 июл 2012

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Комментарии : 13   
4 года назад
This is the best video i find about thermal profiles
@tamilselvans3555
@tamilselvans3555 3 года назад
This is the best video and technical knowledge session, Excellent sir
@sergeysergey5307
@sergeysergey5307 3 года назад
very useful information, all theory in one video, excellent work
@firepower9966
@firepower9966 2 года назад
Great Teaching, detailed and clear descriptions.
@jonasjonsi340
@jonasjonsi340 10 лет назад
Hey, I think there's a mistake. At the right side you take some notes concerning the eutectic point. It has to be 63:37 - Pb:Sn according to your phase diagram. However, you speak of 63:37 - Sn:Pb in your shear strength diagram?!?
@fufu8403
@fufu8403 5 лет назад
Didn't see any mistake. The X axis is wt.% of Sn and the eutectic point is 63Sn-37Pb.
@pradeepkumaryadav3375
@pradeepkumaryadav3375 3 года назад
Tin lead alloy why not used in gold and silver plating
@radiotvrepair1059
@radiotvrepair1059 4 года назад
Thank you very much . you can give me the PDF
@adambimantoro7805
@adambimantoro7805 4 года назад
please help to make profile for my mesin sir ....my mesin Honton R392...
@samynashabeh
@samynashabeh 4 года назад
Mistake at 33:02 - He said the percentage tin is 3% and that's wrong. The percentage tin is 96.5%, percentage of silver is 3% and percentage of copper is 0.5%.
@prahladsharma5937
@prahladsharma5937 4 года назад
Can you tell me what will be Happen when reflow tem increese above to 250Dc
@firstlast8190
@firstlast8190 3 года назад
15:00
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