great video Zach, thank you When stitching vias are made denser for better shielding, doesn't the fixed distance between the gaps in the footprint shown here worsen the situation depending on the frequency?
Sure it would but you can always fill in those gaps with fill or polygon, and then you can add the stitching vias as usual. What they show in the drawing is only a mask opening for exposing the copper pads and for applying solder paste.
The default rule in Altium Designer is 4 mil but this is large in my opinion. I always use 1 mil so that I can place things closer together as needed but it still leaves a small tolerance leftover to account for any potential misregistration. With fine pitch components using 1 mil will leave smaller slivers between pads. Some fabrication houses will recommend minimum sliver sizes of 4 or 5 mils, so this can require you use smaller mask opening to achieve.
