@jkgamm041 I agree, not everything is BGA, I work at an aerospace lab as a student, we do a lot of board fabrication (using reflow oven mostly) for populating boards. Lot of surface mount IC's used, why I'm watching this video, this is a priceless skill to have. Great vid by the way!
The answer is flux. Flux is required when soldering to remove and prevent oxidation on the surface of the metal. Rosin and acid core solders are manufactured with the solder wire as a tube and the center of the tube contains the flux. If you melt the wire directly on the iron without the use of additional flux (and it is common not to use it when doing through-hole soldering) the flux from the core will never reach the metal you are soldering. It will evaporate in contact with the iron.
Navy still uses J leads, gull leads, pqfp, plccs, soics, sots, all kinds of stuff i'm a 2m tech if you couldn't tell. General Dynamics supplies a lot of electronics to us
Awesome skills! I'm wondering if it would be possible to also use a technique where you apply solder paste to the solder pads before placing the PLCC on the PCB, and then use a soldering station to apply heat and make the connection?
He's using a different technique to apply the solder which applying to the iron is appropriate. His technique allows the solder to melt from the iron, then flow down to the pins.
If you use a chisel tip, instead of this specialized tip with a concave surface, can you still achieve the same type of drag effect leaving no bridge connections?
Exactly, BGAs are for precise electronics wich need a lot of connections in a single chip/processor. Who doubts, open up a computer, many of the controllers aren't BGAs, RAMs and processors use them becuase they need hundreds of contacts. Amplifiers almost never, if ever use BGA, nor capacitors, LEDs or jacks/connectors.
No, no you could not. Chips are wired in, some with QSBs as well, but overall, it's all manual standard soldering. There's no cheating with modchips, especially ones that employ a hardware glitch in order to function.
+Raul Romero - For Sn63 Pb37 tin/lead eutectic best manufacturing practice is a default temp in the range of 600-625 degrees F. Lead-free alloys require 700-750 degrees F with additional dwell time (contact) of usually 1-2 seconds as the silver in SAC alloy has a higher melting point.
