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S9-E2_Pragmatic FlexICs-Part 2-Pragmatic’s FlexIC platform: Technical aspects and MPW Services 

EUROPRACTICE Services
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In this webinar, we take you on a deep dive into Pragmatic’s FlexIC technology and explain how to access the service.
In the first part of the webinar, Suman Balaji will give a description of Pragmatic’s technology, its key features, and the Process Design Kit (PDK) that is required for designing circuits. Going more into details, we will continue with a description of the PDK parameterized cells (Pcells) and
devices such as a transistor, resistor and capacitor that are available in the PDK package, briefly touching on the metal layer interconnects and technology stack available for designers to layout their circuits and ICs.
Pragmatic’s PDK is compatible with industry-standard electronic design automation (EDA) tools, such as Cadence, Siemens, and Synopsys. In this section, we will go through design tools, environments and available files that IC designers can use to design circuits using Pragmatic’s PDK.
We will also showcase examples of what can be achieved with Pragmatic’s technology.
After the technical introduction, Adil Masood will explain how to access the Pragmatic FlexIC MPW service through EUROPRACTICE. This will include a brief introduction of EUROPRACTICE, MPW services, steps to access the PDK and register for MPW runs.

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26 сен 2023

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Комментарии : 2   
@suyashshrivastava5936
@suyashshrivastava5936 9 месяцев назад
Hello suman, this was insightful. As you discussed about the minimum channel dimensions, it would helpful if you can provide some inputs regarding the maximum channel width for layouts.
@waynemorellini2110
@waynemorellini2110 7 месяцев назад
What are the advantages over a better fpga technologies, or ultra small controllers from riscv or future greenarrays? They shld bear this in many ways and scalable to 1mm chips, better energy consumption, faster. The ic's can upd be used off the roll, so to speak. Only in cost dies thos have advantage but not per unit pf performance. I wpuld have thought they would have gotten it down to 100nm size and materials which can handle an arm at 1ghz+ by now. The process seems to suit a chiplet carrier or circuit board, except I suspect that the technology hss to increase. I'll give you a tip of a technology which might suite your process. Magnetic cellular automata, can operate at excessively low currents, and the performance could be a magnitide higher on tbos technology. That offers clear advantages, as no MCA exists on dies yet, asot was performance constrained compared to silicon, tbough they are talking about 4thz now, and there is another magnetic computing research technology they are aimimg ar over 20Thz. It matters the technology you can make on a fiexible substrate here.
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