you lost one cap next to emc and also the ram reballing is not always good for this you need stencil like for the cpu. this solution has success like 1 to 100 because you need to be extremely precise and know the heatings and also the volumes of the solder paste to create same bga balls. pop package is not always good for handcraft.
Minta wa fesbuk boss sy mau belajar sama sampean tapi cuma alat ya punya solder. Tester sm kaca pembeaar doang ...sy cuma pengguna gak ada biaya buat beli blower
El problema era de memoria porque sacaste la cpu, el celular quedaba en el logo porque no llegaba al sofware por ende es la memoria la q no respondia. 🤪