Oh boy, I've finally found someone who likes to keep all the little scraps. And the idea of putting and entire piece of paper behind something never to be seen...can't do it. Thanks for sharing your lovely card and the awesome tips.
Congrats on your new crafty tool 🥳 I really hope you will have fun with the Glimmer Hot Foil. If you want mere inspiration for using ordinary wafer thin dies with the Glimmer Tool I recommend another of my videoes. Perphaps you have already seen it, but just in case here is link to it 😁 ru-vid.com/video/%D0%B2%D0%B8%D0%B4%D0%B5%D0%BE-S35jxPOC6EM.html
Hi Lorraine, just posted a new Hot Foil Technique video with wafer thin dies. I highly recommend this one 😄 I have found out how to get thicker lines/impressions with wafer thin dies 😆 ru-vid.com/video/%D0%B2%D0%B8%D0%B4%D0%B5%D0%BE-NTPzzTVrVTs.html
I just got the Glimmer system and saw your tote with you taping the foil together and putting this on the surface to wait till it was ready to put thru the die cut machine. I had no idea we could do this. Saves lots of shifting and saves on foil waste. Glad I saw this! Thank you! Any more tips?
@david: no. The silicone blunts the cutting edge. EDIT: I watched this again and see she is not using the silicone mat. She is still running it thru the machine, but not with enough pressure to cut the paper with the die. Apparently a little experimentation needs to be done….
When you work with Hot Foiling there must not be very much pressure. When you run your Hot Foil base through your die cutting machine you must not feel much resistance. This goes no matter if you are foiling with hot foil plates or with wafer thin dies. If you feel much resistance then you might risk cutting into your plate/base.
That is a good question! I thought she had put down the silicone embossing mat, but when I re-watched it I saw that she was putting down a clear plate. On my big shot, that would cut through the paper and cut the words out.
When you work with Hot Foiling there must not be very much pressure. When you run your Hot Foil base through your die cutting machine you must not feel any resistance. This goes no matter if you are foiling with hot foil plates or with wafer thin dies. If you feel much resistance then you might risk cutting into your plate/base.
Hi Tina, when hot foiling with wafer thin dies the cutting edge it up towards the foil. It will not cut through as long as you dont make you sandwich extra extra thick. If you feel the slightest bit of resistance when running the glimmer hot foil machine through you diecutting machine you must stop immediately! 'Cause then there is a risk you might cut through.
