00:00 Apple WWDC Keynote, Vision Pro, and M2 Chip
00:58 Advertisement Segment
01:32 Has Moore's Law Reached Its Limit?
03:43 Surpassing Moore's Law!?
04:16 What is Packaging?
05:24 Chiplet Integration, SoC, and SiP - What Are They?
06:37 What is 3D Advanced Packaging?
08:26 Challenges of Advanced Packaging
10:23 TSMC's 3DFabric Alliance
11:56 Conclusion
// Further Reading //
Image Chips Like Sandwiches - Three-Dimensional Ultra-Thin Packaging Interconnect Chip Technology
pansci.asia/archives/55595
A Sudden Revelation While Bathing: The Nobel Prize-Worthy Patent of the Eight Traitors - Semiconductor "Planar Process" - "Revolutionary Genius: Shockley and the Eight Traitors"
pansci.asia/archives/351843
// References //
www.charmingscitech.nat.gov.t...
www.tsmc.com/chinese/news-eve...
www.tsmc.com/english/dedicate...
3dfabric.tsmc.com/english/ded...
blogs.sw.siemens.com/semicond...
semiwiki.com/uncategorized/97...
www.bnext.com.tw/article/6302...
ctee.com.tw/news/tech/832581....
www.bnext.com.tw/article/5665...
www.techbang.com/posts/105326...
// Production Team //
Host: Kuowei Cheng
Planning: Hsieh Fu-Cheng
Script: Hsieh Bing-Yi
Editing: Chen Yun-Xin
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4 авг 2024