Webinar: Thermal Interface Materials for Power Modules 

In power electronics systems design the thermal interface material (TIM) plays a crucial role in the overall of the end product. It is the main contributor to the complete thermal impedance between the power electronic chip and the heatsink. Thus optimizing TIM is very sensible and can lead to great benefits in the application.
In the first part, the webinar explains the working principle of TIM. It presents and compares different materials. A special focus is set on optimizing the thermal interface material layer: the influence of material choice, layer thickness and printing pattern are discussed in detail. The webinar’s second part guides the user through the choice of the right material. It explains which material is used best for different power modules and how the user can benefit from pre-applied TIM on the power module.
Key Take-Aways
Discover the working principles of different thermal interface materials
Understand ways to optimize thermal interface materials’ performance
Learn about expected performance improvements
Find out the benefits of pre-applied thermal interface materials
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