More data requires more processing and more storage, because that data needs to be stored somewhere. What’s changing is that it’s no longer just about SRAM and DRAM. Today, multiple types of DRAM are used in the same devices, each with its own set of tradeoffs. C.S. Lin, marketing executive at Winbond, talks with Semiconductor Engineering about the potential problems that causes, including mismatches in latency and higher demands for throughput and lower power in domain-specific designs.
23 июл 2024
