WIRE BONDING (PART 1) 

Shinkawa is one the best bonders. My first wire bonding experience was in 1991 using UTC-30 / 40 bonders

@WATCH LEARN 'N PLAY nice, I did installs if the US, 20 and 30 aluminum, UTC-10, 50. 100, 200 gold ball. KnS 1470 aluminum wedge, KnS 1419 gold ball. Cypress Semiconductor in San Jose was my favorite places to work. I learned a lot from some of the best Philippino technicians in the world there and that launched the addiction for wirebond. :-)

Fresh from college in 1991 I started at Amkor Philippines which was previously an AMD assembly and test facility. I was amazed to see those 1470 and 1419 bonders in action doing at least 100+ wires of PGA package.

@@watchlearnnplay 1991 Amkor...? era ni Tony Ng and Danny Acuna sir... those were the days :D

​@@KufalainenYes sir era ng mababangis

Thanks for commenting and appreciate your attention to details

Silver corrodes while gold does not.

@@tenlittleindians Au wire FP2 from haereus has high resistance on corosion, the rest of Au corode, even the one from GPH by tanaka.

do you mean segmented parameters for 1st bond or ssb? if the device is unstable, segmented is ideal.

If you mean mashed ball dia, it will be slightly bigger than your capillary CD. But you need to correctly set your FAB diameter to achieve your target MBD. This topic is covered in wire bonding part 2 video

@@watchlearnnplay I saw the story, too

@@watchlearnnplay Is there a separate formula?

"Optimum parameters" is always a relative word and is affected by many factors particularly machine type and setup, materials which includes the device your are bonding, wire, and capillary. Typical parameter range for 1st bond, which is a good starting point, is 10 - 30g bond force, 10 - 30ms bond time, and 300 - 600mW USG power. Again, this is a starting point. You can do some bonding trials and make some adjustments to see how the bond quality change then you can optimize. Typical heater block temperature for new generation bonders is 100 - 150C. But some materials are not suitable for high heat so a lower temperature maybe needed and then compensate the bonding through higher bond parameters which could be the case in what you found in the internet. I hope this helps.

@@watchlearnnplay thank u for your response sir, anyway. Can you share and discuss on how to set-up on K&S maxum and K&S iconn.. i have an idea came from my workmate i want to make it clarify from u if its okay to u. First step, check the program of the set-up in the monitor. Second, place the leadframe into magazine and the indexing or(material handling system)it will transport the leadframe into the eyepoint, and this time, eyepoint is the way to see the die bond/IC whether in correct position or not then adjust. Next, PRS :: if this exact..can you tell/share me sir what next to do in PRS. (To be honest Sir I am working at Wafer probing but Im willing to study and conduct knowlegde about wirebonding process thats why I go to internet, search, take some note, play video about wirebonding even w/o experience and asking about your video.. Can help me sir, or clarify may set-up flow about K&S maxum/iconn. Thanks a lot. It will be a great dept of gratitude.🇵🇭

I'll be posting about machine setup in the future. Also you can email me your questions and I'll answer them the best I can. Just to note, when I started in 1991, I learned a lot working with operators. Learning to do what they are doing will help get the feel of the process. Keep learning.

@@watchlearnnplay yep...you got it right.......Bro.....

From my many years... Can you tell me the metalization of the bond pads, sizes, wire size? And issues such as non-sticks, creater/cracked pads? Die material such as silicon or gallium? Also substrate type such as copper with tin plated l ead fingers, LLC types with gold plated lead/(second bond) any temp limits from/do to maybe doing a multi-chip package (BGA) with pre-soldered components as not to have affects on solder joints. When thinking bonding, there is a grams per square mil area, temperatures, pre-heating with heated N2 gas etc. I started to learn wirebond in 1975 at Toshiba working with the very first fully automatic wirebonders in the US, they had stepper motors, mechanical cams. Springs for bond force (no voice coils or optics. We built 25 lead 400 mil p-dips for the first Nintendo games. The early digital programming was through dip switch settings on a board and or the old paper punch cards fed through a Fairchild testing machine to serve the machine data coordinates for bond locatins. Early development phases.