Well done, Navid!

不错

On slide WLP Challenges: "Nickel" instead of "Nitrate" for UBM?

nice! thank you

For mold first the carrier wafer is only needed during molding, right? Why does it have to be silicon?

correction no. 2: (15:35) - there are sockets for BGA;

Motorola 68020 has PGA package from 1984

Please share your contact details Please

Things that I can learn for one month it takes five years since 2019.

Now computer design tools actually integrate all of these domains 9:26 kind of their own in the background. My algorithm is doing that configuration through 'Logical optimization'.

Stacking of ICs one above other in layers connecting them together.

very good lecture

Take a look at entire series

Thank you very much☺

Amazing video !

سلام و احترام جناب اسدی.ممنون از آموزشهای بسیار خوب شما. جناب اسدس من دانشجوی ارشد فوتونیک در ایران هستم و دنیال یک مثال آماده nonlinear micro ring resonator هستم.آیا شما چنین مثال آماده ای که با FDTD شبیه سازی شده باشد دارید؟ یا منبع و پایگاهی سراغ دارید که دانشجویان فایلهای شبیه سازی شان را به اشتراک بگذارند؟

reading peed is too fast to follow

I can't wait for engineers to start writing software in a form that can be read by these systems, so we'll finally have software and hardware unified.

Thanks for the comprehensive overview!

Daniel, Nice overview Please consider a takeaway statement at the bottom to highlight your conclusive intent 1,000 points

awesome lecture, thank you!

What can you say about durability, long lifespan of Power management IC units in Chiplet

Is it possible to get the slide deck?

good video 🙏 but it's awkward for a package substrate introduction video, ABF is not mentioned at all....

all big and great company in the world😮

Very informative

Great video!

سلام و احترام جناب اسدی. امکان راهنمایی و کمک در انجام پایانامه رشته فوتونیک وجود داره برای شما؟

Many thanks.

Thanks a lot Dr. ❤

Great video, seems like you put the same section once, when talking about thermal reflectance microscopy, please check it out, thanks!

the clearest explanation for interposer. I have been confused for a long time.

Well done. Now understand what an interposer is. Thanks!!

Very interesting and good to know to learn 3D packaging for beginner! Thanks to share

Very useful keep making videos

greater power, more thermal issues😀

Dr. Navid is treasure. Really enjoy all of his presentations and learn so much.

In 1992 Motorola designed and created 1200 pin CBGA's for the PCB's on the Iridium payload.

Thank you so much for these videos. Easily the best I have seen in my 8 years in the industry.

These presentations are very good, but sadly RUINED by constant advertising every few minutes.

Hello can I get your presentation file？

Thank you

Great video! 👍 thank you!

You're missing Lightwave Logic under the Design listing

Arey Bhaiya All Is Well

이 아저씨가 제일 설명 잘 하는거 같아요ㅎ

One day we'll catch up with Startrek!

You should have shown more photos of each type.

Why not use interposer only and remove the substrate ?

how much lower energy demand? %?