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Packaging Part 6 - Wafer to Panel Level Packaging 

Navid Asadi
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References:
[1] Gotro, J. (2018, March 18). Polymers in electronic packaging: Introduction to fan-out wafer level packaging. Retrieved March 01, 2021, from polymerinnovat...
[2] Panel level packaging. (n.d.). Retrieved March 01, 2021, from www.ulvac.co.j...
[3] G erven, P. (2017, January 19). Euv for dummies. Retrieved March 01, 2021, from bits-chips.nl/... for-dummies/
[4] Fraunhofer IZM, Volker Mai, Fan-out wafer- panel level packaging. (2019, February 07). Retrieved March 01, 2021, from www.izm.fraunh...
[5] LAPEDUS, M. (2019, March 03). Fan-out wars begin. Retrieved March 01, 2021, from semiengineerin...
[6] Kumar, Aditya & Dingwei, Xia & Sekhar, Vasarla & Lim, Sharon & Keng, Chin & Sharma, Gaurav & Vempati, S.R. & Kripesh, Vaidyanathan & Lau, John & Kwong, Dim-Lee. (2009). Wafer Level Embedding Technology for 3D Wafer Level Embedded Package. Proceedings - Electronic Components and Technology Conference. 1289 - 1296. 10.1109/ECTC.2009.5074177.
[7] Braun, T., Becker, K.-F., Hoelck, O., Voges, S., Kahle, R., Dreissigacker, M., & Schneider-Ramelow, M. (2019). Fan-Out Wafer and Panel Level Packaging as Packaging Platform for Heterogeneous Integration. Micromachines, 10(5), 342. MDPI AG. Retrieved from dx.doi.org/10.3...
[8] Happich, J. (2015, June 26). Wafer-level packaging is not enough, SAY OSATS. Retrieved March 01, 2021, from www.eenewseuro...
[9] Fan, X. (2010). Wafer level packaging (WLP): Fan-in, fan-out and three-dimensional integration. 2010 11th International Thermal, Mechanical & Multi-Physics Simulation, and Experiments in Microelectronics and Microsystems (EuroSimE), 1-7.
[10] Yuan, J., Jeung, W., Lim, C., Park, S., Kweon, Y., & Yi, S. (2008). A low-cost through via interconnection for ISM WLP. Microsystem Technologies, 15, 1273-1277.
[11] Verizon Wireless Motorola RAZR V3m - Silver. (n.d.). Retrieved March 1, 2021, from www.amazon.com...
[12] IPhone 5s - Technical Specifications. (n.d.). Retrieved March 01, 2021, from support.apple....
[13] Fraunhofer IZM, Volker Mai, Fan-out wafer- panel level packaging. (2019, February 07). Retrieved March 01, 2021, from www.izm.fraunh...
[14] Lee, C., Bondur, T., & Ranjan, M. (2017, April 3). Technology and economic considerations for panel-level fan-out packaging. Retrieved March 01, 2021, from blog.lamresear...
[15] T. Braun et al., "Panel Level Packaging - A View Along the Process Chain," 2018 IEEE 68th Electronic Components and Technology Conference (ECTC), San Diego, CA, USA, 2018, pp. 70-78, doi: 10.1109/ECTC.2018.00019.
[16] Fraunhofer IZM, Volker Mai, Fan-out wafer- panel level packaging. (2019, February 07). Retrieved March 01, 2021, from www.izm.fraunh...
[17] Braun, T. Fraunhofer IZM (2015). Opportunities and Challenges for Fan-out Panel Level Packaging (FOPLP). In SiP Global Summit. Taipei, Taiwan. Retrieved from docplayer.net/....

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17 авг 2024

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Комментарии : 14   
@richh9366
@richh9366 10 месяцев назад
Dr. Navid is treasure. Really enjoy all of his presentations and learn so much.
@haoxu4328
@haoxu4328 Год назад
Really informative and well-structured presentation! Thank you very much, Pls make more like this!!!!
@ErossaanBooming
@ErossaanBooming 3 года назад
Very Impressive how structured your presentation is :)
@depressivepumpkin7312
@depressivepumpkin7312 3 года назад
thank you very much for not having a heavy Indian accent, cheers
@miNIMMAlmovement
@miNIMMAlmovement 2 месяца назад
It's Alonso so why would he?
@zhangwisdom5660
@zhangwisdom5660 3 года назад
Fan in and Fan Out session, it is pretty good for useful.
@SK-le1gm
@SK-le1gm Год назад
amazing presentation thank you !!!
@falconi7633
@falconi7633 26 дней назад
On slide WLP Challenges: "Nickel" instead of "Nitrate" for UBM?
@MrBubblegumx
@MrBubblegumx Месяц назад
For mold first the carrier wafer is only needed during molding, right? Why does it have to be silicon?
@eima7644
@eima7644 3 года назад
Make more of this video, please. 3D stacking manufacturing processes and such.
@jorgekaz07
@jorgekaz07 Год назад
Very nice presentation, very informative. Just a small question: pg2 is "badge" supposed to mean "batch"? Otherwise great video. Thanks for sharing!
@frederikvanstolk5815
@frederikvanstolk5815 Год назад
Why would die shift be a PLP issue more so than a WLP issue? If it's due to CTE mismatch you'd see it happen in WLP as well surely?
@hgb1696
@hgb1696 3 года назад
What's difference between Cowos and WLP, does foveros and cowos do not pkg on the wafer level?
@dylan522p
@dylan522p 2 года назад
Navid confused about your comments on panel level. Intel uses panel substrates from multiple vendors.
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