Introducing the AMT5000: Revolutionizing HBM Die-Level Testing
The AMT5000 is the world's first die-level test handler specifically designed for High Bandwidth Memory (HBM) with an unprecedented 5-micron alignment accuracy. This innovative handler minimizes scrap and rework costs for expensive HBM chips by enabling final testing at the die level after sawing.
Key Features of the AMT5000:
Unmatched Accuracy: Achieve unparalleled precision with vision-guided alignment and adjustments, ensuring a deviation range within 5 microns for fine-pitch probing.
Eliminate Jigs and Trays: The AMT5000 eliminates the need for jigs, trays, or pockets, streamlining your testing process.
Broad Compatibility: The handler seamlessly integrates with most existing test probe cards, accommodating 3D stacked HBM cubes and SiPs.
Reduced Costs: Minimize scrap and rework expenses with final die-level testing.
Take your HBM testing to the next level. Contact Calvin Park at calvinpark@imamt.com to learn more about the AMT5000.
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17 авг 2024