Popcorning, delamination, warping just some of the problems engineers face in modern manufacture. Handling Moisture Sensitive Devices & PCBs - Without Failure. If you need a online training session just let us know
Fine pitch surface mount components and printed circuit boards all absorb moisture at different rates. During soldering moisture turns to water vapour and can generate considerable internal stress which may lead to premature failure. In the case Quad Flat Packs (QFPs) and Plastic Ball Grid Arrays (PBGAs) the resulting defect is often referred to as “popcorning” due to the sound of steam escaping from the package. When printed circuit boards outgas you see minor soldering faults, full delamination, blistering of the board or very subtle via hole failure
Considerable research into the correct procedures to minimize problems with bare boards and components has culminated in IPC standards to help guide engineers to reduce the possibility of failure. Bob has put together a session on each of the issues associated with the prevention of failure, correct onsite operating procedures and the equipment than can be used to store products and eliminate failures of this type
In preparation for the event and to ensure you are equipped to get maximum benefit from the event, read our Webinar Guide
Presented by Bob Willis
Topics included in our webinar:
Component and PCB failures
Baking components and PCBs
Moisture absorption rate and loss
Impact of baking on solderability
Methods of moisture absorption
Benefits of dry storage
Baking assemblies prior to rework
Storage methods and failure analysis
2 дек 2022
