Next generation WLCSP inspection platform optimized for small factor-factor processing at high speed and yield. Infrared NV-Core technology enables micro-scale defect detection below the device surface. Artificial Intelligence algorithms enable pattern recognition and precise detect classification. Automation compatible solutions supporting Industry 4.0 requirements.
Read more: www.cohu.com/neon
________________________
Like this video? Subscribe to Cohu, Inc. on RU-vid: / @cohu
Connect with us on:
LinkedIn: www.linkedin.com/company/cohu
Twitter: cohu_inc
Instagram: cohuinc
7 июн 2022
![[Eng Sub] Wafer Level Chip Scale Package (WLCSP)](/img/0.gif)
