1. WLCSP
: Die, Repassivation, Bump
: Repassivation(PI, PBO - HD MicroSystems)
: Batch Process
2. Structure
: Bump on Bond Pad
: Bump on RDL
: Backside Coating - Backside Lamination Tape
: Side protection - 6, 5, 4-side
3. Process
: Bump on RDL
4. Application
: Power management IC , Audio codec
1 авг 2021