Jamie Pederson shows off Panasonic's new thermal conductive material, the pyrolitic graphite sheets. Even burning with a torch, it will not fail. Find it here: dky.bz/pgsproduct
I got some of this material the Digikey # P14965-ND THERM PAD 180MMX115MM W/ADH GRAY 0.0008" (0.020mm) The thinner the carbon pad the better the transfer vertically if you read the specs. I used it as a cpu thermal transfer on a Intel 9600K in place of thermal compound. It is easy to cut since it has a removable mylar backing. With the mylar removed it holds together and has a slight adhesive so it stays in place. You can peel it off to reposition if you need to. I could not see any difference in the cpu temperatures after application. One sheet is 4.5" X 8" so you can do a good number of cpu's with one sheet.
It sounds like you would be wanting a thermal blanket that insulates rather than conducts heat. Shielding heat would require an insulation layer to cover or mask the elevated temp.
@PhysicsAstronomyUofU I apologize for the confusion. Unfortunately, we received the thermally reactive tape from Panasonic for the purpose of the demo.
The datasheet says 400°C, NOT Fahrenheit. The max temperature in Fahrenheit is 752° Also, in your first test, is it really a fair comparison? I'm betting the copper strip has a greater heat capacity than the graphite strip, so, of course the graphite strip transmits heat faster and cools down faster. A more informative test would be to heat two identical thermal masses, such as two cubes of solid copper, and then attach the copper strip to one, and the graphite strip to the other and monitor both for how fast the copper cubes cool down (i.e. how well does each conduct heat away from the copper cubes and dissipate it.) In other words, your tests gave me little information about how well the graphite sheets function as a heatsink.
You can't buy this on Amazon. 1. You use it between the CPU cooler and IHS, not silicon die and IHS. 2. You can use it between the die and IHS. However, you do have to cut and exactly apply it to the area of the chip. 3. Buy it here: www.digikey.com/products/en/fans-thermal-management/thermal-pads-sheets/218?k=&pkeyword=&pv567=1267&sf=0&FV=fffc000a%2Cffe000da%2Cffecfdc9&quantity=&ColumnSort=0&page=1&pageSize=25 Always look for Soft PGS, not PGS.
The reason for not putting it is that alone, under the IHS, unlike between the IHS and the heatsink, is that there isn't a lot of mounting pressure, and there may be a big airgaps, meaning a lot of heat However, if you put liquid metal on the die, and soft PGS on the inner side of the IHS, or even any other excellent thermal paste, you get absolutely outstanding thermal performance actually! TLDR: 1. Put in between IHS and heatsink, since there is a lot of mounting pressure. 2. Do not put soft PGS between IHS and die because of low mounting pressure. 3. For absolute best performance possible, but liquid metal and soft PGS between the IHS and the die.
@PhysicsAstronomyUofU both Steve Spangler and Educational Innovations have Color/White thermochromic paper. I see that bulk suppliers of thermochromic ink are listing orange/red or orange/magenta inks. Maybe you could track them down and wheedle a small sample for making your own paper. might be CTI thermochromic ink, their website shows $50 for a 1lb sample of offset printers ink of various color-change.
This foil is made of CARBON? Looks very metallic. Grey, flexible, shiny substance. Good conductivity. Very high melting point. Caarbon relly con be considered as metalloid, especially when selenium is classified s it.
I thing yes, but not in the same way we use thermal paste. I want to mod my laptop covering the interior case and connecting my heatsink and others thermal pads (Panasonic PGS too) to a layer of this (my inferior interior laptop peace is made of aluminium. This material is superb for spread temp.
Does one side adhesive type of pgs insulate heat or insulate electricity. Because in the data sheet it is mentioned only as insulation but what kind of insulation.
