Hi, in reality, after slicing, the wafers have a thickness between 300 µm (2 inch), 550 µm (4 inch) or approx.1 mm (8 - 12 inch). Lapping adjusts the finally required thickness.
I Was looking for good animation with Czochralski method for Virtual World learning purposes. This one is great and will be featured in Polish History House informative model in Second Life.
I have got a question to all the CZ-experts among you: Does the sewing-process of a silicon wafer have any influence on the thickness a single, specific SI-wafer? In other words: is the thickness of my specific wafer anywhere the same?