Wafer level chip scale packaging is becoming the new standard process in the MEMS industry.
SPEA is a leading supplier of complete solutions for testing and handling chip-scale packaged MEMS devices.
SPEA test cells combine the physycal stimulus required for the MEMS functional test and calibration with a complete electrical test, fast pick&place handling, reliable DUT contacting.
They are designed for the tri-temp test of semiconductor or MEMS devices made with standard package or chip-scale packaging technology, offering the great advantage of a single equipment able to handle both types of devices.
29 янв 2018
