The Microspheres Hiding in your Phone's Screen 

Good work!! I forget what it's called but the old LCD displays used a flexible rubber "Z" strip with thin metal sheets with flexible rubber. Worked really well!

Thanks for that additional info. That was the biggest question I had after watching this. Trying to work out how hard they need to push the component down on the tape to crush the balls, and how it doesn't just spring back off, In other words, what keeps the pieces clamped together? Also the example where the traces were contacting the pads without the aide of the balls, I was trying to work out how that happens when there should be some thickness of tape between them. Heating it must liquefy the carrier compound to an extent that it pushes out of the way, and cooling it would set everything and hold it in place.

good craft

@@fjs1111 zebra strip and it failed pretty regularly lol

The element detection feature is so cool to see!

Fixed many a Nokia and I think Gameboy? With a bit of paper to apply a bit more pressure to those zebra tapes back in the day. I didn't even know this new one existed, that's pretty cool.

Yup. Used those in the ‘70’s

Long ago I used the Tattletale 8 SBC which used the similar 'Squishy Bus' to mate to a carrier board. It was always a little concerning due to board flex but it seemed to do the job ok.

Gonna see if I can find some in my pile of old electronics! Thanks for the tip, I hadn't see that before!

Aye! That's what I've known it by. Still being fairly new to circuitry and building electronics, I only learned of it a few years ago. Real neat!

IM gay

​@@nilstrobaggia735👍

Comments like yours help me know when I found a good channel 😃

🤦‍♂️

Try finding out how they make acupuncture needles and the micro needle they inject cells with

And at that, it's not so much the metallurgy (which takes place more up in the 300-600°C range) as the packaging. It feels like... a lot of the early plastic encapsulations suffered from poor dimensional stability, resistance to moisture, and adhesion to the lead frame, perhaps? And I say "suffered", but they were certainly reliable enough for their time (lifetime of a couple decades is well more than any commercial product should expect!). That they often do so much better than this, bears some testament to their success, to the delight (as well as eventual consternation) of vintage enthusiasts. These corrosion processes depend on environmental conditions like oxygen, moisture, and trace corrosive gasses; just keeping things dry and reasonably clean (stored in boxes, away from dust) goes a long way, and keeping things completely dry and free of contamination (silica gel + activated charcoal adsorbent, say?) and cool (sure, they could be frozen, or even less), should jack up the lifetime. The alternative of course is choosing wholly metallurgical components -- i.e. replace those fragile plastic parts with CERDIPs and whatnot. Not always feasible of course, for many of the same reasons they weren't chosen in the first place, for that matter (availability, cost, performance, size/shape even).

​@@T3sl4 I think he is referring to the physical process of diffusion, without an outside influence. At room temperature, the statistical chance of a particle of metal acquiring enough energy to move around the surrounding structure is almost 0%, but not quite 0. And there being billions of atoms, from time to time some of them will indeed acquire enough energy to move. Over the years this will degrade performance, until the device stops working. The higher the operating temperature, that much faster will diffusion occur (it's exponential).

@@WetPig Right, but long exponential tails aren't meaningful even over historical time scales. Most semiconductor, metal and ceramic materials have activation energies far above room temp; but the other mechanisms I listed do have lower activation energies, so will tend to dominate.

Maybe wacuum packeting those? Totally remove air. It removes even moisture, if there's some. Maybe after that whole thing could be left under liqud nitrogen to for storage.

@@T3sl4 Actually, a large area of defect reduction in semiconductor manufacturing is preventing copper from vias from diffusing into high-K dielectrics at the normal semiconductor's operating temperature and conditions through the use of diffusion barriers. Temperature is not the only factor that influences diffusion in semiconductors.

Which companies do EEs get jobs easily at? I am a software developer but I have always been interested in electronics. I wanted to setup a home automation company when I was young lol but the country I am from, it's more likely to not happen. In my country there's no job security for EEs you see. If there was, I probably would be in that field.

*Now the question is HOW to use that kind of adhesive for SMT? Hotplate SMT soldering has solder bridging issues and so on, as I sadly found out when trying multiple times. So adhesive of that type seems like a possible solution. Heard if there is already a way to spray a layer of that on a PCB?*

Nothing is really impossible for everything a human can imagine or conceptualise has it's bases on what we have observed or known It's just finding a way of materialising

@@a.r.h9919 Yup, another way of seeing it is: Nothing is impossible but most things are economically unfeasable.

Oh neat, I didnt remember that he used ACF for that project! Will have to go give it a re-watch

Me too!!!

Laser microscopes are a thing

Have you seen how holograms are made? Also, obligatory cheap green lasers can punch your eye out with invisible and undetectable 808nm and 1064nm infrared light. Any DPSS laser like the common 532nm is packing a pump diode that puts out much more than the "safe" 5mW legal limit. Some have IR filters, most cheapos don't. Most any other diode laser, including the new green ones (~500-520nm) is probably grossly underrated on output power due to marketplace regulations. Before those regs, they used to sell them as toys to light stuff on fire. Now they have to be below the legal limit to sell but of course nobody setting these rules ever checks anything. Be careful with those reflections!

My guy what’re you even training for that has you watching casual RU-vid videos on 4x speed. I just tried 2x which is the max and it was understandable just annoying as hell. Like genuine question what possible reason could you have to watch this that quickly, it’s not like you’re studying for a test

right? I've heard that they use psychedelics to reach this level of visualization and creativity 🙂

these advances are beyond reason, the tech is almost other worldly

Alien tech

There's nothing complicated about connecting two conductive surfaces with a metal ball. They envisioned how they could make it happen, and this was how it was made to happen. You just 'aren't that guy' if you cannot come up with solutions like this.

@@BuzzingGoober No it’s not complicated. Most technologies are simple in theory, but producing “plastic” micro spheres, coated with conductive material, takes some doing. Are you a bot thinking your talking to a noob?

They probably still wouldn't meaningfully conduct, since there isn't any compression giving them proper contact with each other. I'm mostly surprised that there aren't too many issues with some unlucky contacts not having any spheres.

Chips won't go pitted, because there's generally a layer between them and the IHS, such as thermal paste or pads. So even copper in contact with an IHS doesn't really corrode in its usable life, because it's protected from air at the contact point. Of course everything else would corrode, and that's mainly for aesthetics rather than functionality.

@@peoplez129 It's not the inside we're concerned with. That is sealed from the outside world. The silicon itself won't corrode, since it already has a layer of oxide on it. The greater concern is the outer surface, which is exposed to the atmosphere for extended periods of time. Pitting takes a long time and is the extreme example, but even tiny copper oxide spots ruin the thermal properties of that area of the IHS and create hotspots.

Thanks! Really appreciate that!

Agreed. This video was over way too soon.

Honestly that was my assumption too! I figured it had some kind of pillar structure :)

@@BreakingTaps Crazy how simple some solutions to complete problems can be.

Such a simple and clever solution to the problem! I assumed it would be some kind of complicated honeycomb/pillar structure when I first heard about it. But nope, just little spheres :)

I agree. The term I like to use is elegant. Simple, easy, cheap, reliable, fast.

🥰

I was going to... and totally forgot 😅 The spec sheet for mine claimes 1ohm resistance so it's just "ok". Also limited to

@@BreakingTaps Is that all it says or does it give it as a per area? I'd expect larger or smaller pads would affect the resistance and current capacity.

@@LanceThumping Datasheet just says "ITO electrodes all over / TCP; bonding width, 1.5mm", so not entirely clear to me what the actual dimensions were. 😔 Spec sheet is here if you'd like to take a look! www.fsrkj.com/upfiles/201712/22/af0aa1f1cb2886b6f.pdf

Someone just mentioned that to me: Zebra connections! I hadn't seen it before, but going to go dig through my old electronics pile and see if I have any laying around. TBH that's a lot more like what I was expecting from the ACF, some kind of pillar structure, not just random particles :)