Demonstration in NPL's Clean Room of gold deep access wedge bonding using a Delvotec 5300 series bonder. Bonding is carried out on a ceramic test chip featuring gold contact pads
Why are you fully covered? I work in this industry and everyone is wearing regular clothes, no masks, any health risks with epoxies or ultrasonic machines?
when the wedge preses the wire down to the surfice,the ultrasonic bonds the wire and when the bonding process is finished the clamps that are located (on this device probuably) a bit higher than the wedge, pulls the wire that causes it to brake off from the bond. you can clearly see the clamps pushing the wire forward after the bond has been made. That would be my guess.
wire break by clamping method when wire bond finish the wire hold by the wedge and it pull for thin wire ,if it tick wire it will use by cutter process you can check my video
