45) Solder Surface Tension and Why You Should Care 

I am really sad to see how few people appreciate your top notch infromation... Please keep up the good work :)

Really nice presentation for surface tension and how it cam make smd assembly easier or harder :-)

Great vid, the closeup shots are mesmerizing

"Tombstoning" probably has to be one of my favorite 'technical' terms of all time.

Extremely well done video!

Awesome info and beautiful closeup shots!

Great video, explanations and visuals of the paste reflowing!

A wealth of information as always, my friend! Cheers!

Great video deserve at least like. Good work and nice presentation .

Great video ! Thanks a lot ! However, I suggest using adhesive compounds to stick the SMD module on the PCB before passing through the reflow oven. This will eliminate the misalignment of components.

Great video, thanks!

Hello, about the Silabs PCB Could the reason for the PCB sliding be because the ground pins up in the left corner connecting together the pads? Because that would make the solder flow different If looking at the photoshop picture, they have not flooded between pins. Eventually you could flood over the ground pads which removes the small connection between those ground pads

Great video! I learnt here something today!

This is fascinating, thank you!

nice video, I am using the bgm113 aswell. What I found working best (also for produced pcb's) is the respect the bgm113 footprint. so the recommend landpattern will be drawn af your U1. But you will have a layover with soldermask to coverup the extended parts, now you exposed pcb footprint is the same as the bgm113. This way there is still enough mechanical bond and the bgm113 flows perfectly into place, every time ;)

When you mentioned how heavy the module was it made me wonder if stencil thickness or paste ball size adjustments might help. I was thinking maybe there's too much solder in there and it's pillowing out. Gave it a think and changed my mind, but thought I'd mention it anyhow in case you'd find the consideration useful. I think you're on the right track. Thanks for the video! Also, secret project? Think it'll get a video eventually?

Would it be easier to observe snapping into place with some added gel flux?

very interesting, Lots to learn about SMD manufacturing issues. this kind of issue due to surface tension Makes you wonder why chip manufactures would even make a 3 sided chip. Sounds like 3 sided chips are just asking for trouble. Would it be better to just stick with 2 sided or 4 sided chips?

Useful video 👍

really great explanation .... 😀👍 SUBSCRIBED instuntely 👍👍👍

Nice work. Had to subscribe

Nice vídeo and presentación. Actually, I'm a beginner in this tópics, but apreciatte this vídeo. You're amazing! Regards :)

Nicely produced video, but a couple of points: 0:26 explanation contradicts what happens at the edge of the glass, where the water is attracted up the surface of the glass -- an example of wetting, essentially the _overpowering_ of the surface tension in which the adhesive forces between molecules of the dissimilar materials are stronger than the cohesive forces within the materials. 2:06 drag soldering "horseshoe" tip is often (and I think better) called "hoof" tip. Ie: looks like a hoof, and specifically _not_ like the "C" of a horseshoe. I think the "horseshoe" name probably came from "hoof" poorly translated to or from Chinese. 2:10 these are examples of wetting rather than surface tension; eg: 2:17 is not due to cohesive forces, but rather successful wetting of the tip, ie: adhesive forces. (Of course, surface tension is also at work in forming the rounded outer shape of the solder "pillow".)

how to improve the solder joint not good in micro LED? I am facing with it and do many thong but still bad @@@@

This video helped me win an internet argument

Good video, Its amazing how many "engineers" i have seen can't or don't understand the specifics as described in this video, seams they want to "play" with the solder adding more heat until the solder is just ice cream peaks ahha

I've seen bluetooth modules that instead of having flat pads on the bottom, they have pads on the edges and they're cup shaped. this should help centering even iff the bottom pads are elongated.

Subscribed

Hope you're able to pass on that layout problem to the manufacturer. Your hypothesis makes sense.

Can you use too much flux? Thanks for the reply.

couldn't you increase the pad size of the 2 pins to generate tension on the other direction?

Amazing video as always you video making son of a gun

The few places that teach soldering don't even have flux, let alone care for dry solder joints.

+1 sub

easy solution hold it down with tweezers and light pressure.

FLUX.

way too much solder paste 1:30, like 5 times too much