In this video, Josh demonstrates an easy way to distinguish flip chip failure and BGA failure. IMPORTANT NOTE Josh said "BGA flip chip fault" at 0:50, when he meant "BGA and not flip chip fault".
*IMPORTANT NOTE* I said "BGA flip chip fault" at 0:50, when I meant "BGA and not flip chip fault". Bolt mod "working" (temporarily) is not a sign of BGA issue. It presses the silicon to the substrate extremely to the point that it warps the motherboard over time. Only light pressure is needed for BGA issues, you saw how light my hands were.
Yes its informative. I had a corona that had the same similar issues with the display. I now understand why. Thank you again. By the way its been awhile since you used the catchy phrase in your videos intro.
I got a trinity board. Boot without issue, but by random time goes by, it will crash on the screen like the glitch you showed in the video. What's the recommended action? Reflow? Reball? Replace? Well I can only do 1st due to my lack of enough equipment for now.
You need to check as I did in the video. If he crash when you tap/flex/press the board, REBALL the proc. If he does not, and just still randomly, REPLACE the proc.
I had a 360 I took to college and back many times, some have found success from just loosening/tightening two screws on the sides of the power in. I even got it to boot once by doing that lol. So I guess it needs a reball. Although it does show an E82 error so maybe not
At least BGA failure on 360 slims is better to deal with than the nightmare that is the Xenon revision phat 360. Those early revision 360s put out so much heat I wouldn't be surprised if they cooked themselves to death. Though tbh it's more of Microsoft rushing to get the console out the door (kinda like how Sega rushed Sonic 06 in its current state).
None of that is true sorry. Yes, MS rushed the 360, but that has nothing to do with the GPU failures. BGA failure almost never happens on Phat consoles, and they don't cook themselves to death. The GPU is a 55-60W part, much less than the 75-85W CPU. They die due to an incorrect manufacturing process at TSMC with low-Tg underfill and a bad low-k dielectric process, TSMC had lots of issues with their 90nm platform and not only X360 GPU was affected. Many graphics chips made at TSMC were affected including Nvidia 7xxx/8xxx, ATi 3xxx/4xxx, and PS3 RSX. The CPU was made by IBM/GlobalFounderies and made with a proper dielectric process and high-Tg underfill and thus doesn't die. IBM did an extensive test process with Amkor for their 90nm platform and thus didn't make the mistakes that TSMC and ASE did. The BGA issues on Slims occur after the console is subjected to physical shock. A heavier heatsink with less structural support and IHS means shock gets transferred right into the substrate and can crack the balls. It's a mechanical engineering issue.
My brother, I am not so stupid to put a motherboard on a conductive surface. It's a plastic desk protector to protect the wooden desk from scratches. See here: ru-vid.com/video/%D0%B2%D0%B8%D0%B4%D0%B5%D0%BE-8pjI5-a-MUQ.html I am not a foolish man my brother.
@@Josh.Davidson lmao this made my day. the fact that you actually made a quick video explaining that your desk is not conductive and pulled out your fluke meter to demonstrate it made me spill my water. Always love your videos
Dang... I have this exact issue on a xdk slim board, flexing it causes it to crash or not boot... So a bga issue and not a flip chip then, this is better I guess as the xcgpu is rarer in dev variant. Any chance I could pay to get it to you so you could try to repair it for me? I'm in Europe unfortunately, and know no-one here that would do this kind of work...
@@Josh.Davidson ru-vid.com/video/%D0%B2%D0%B8%D0%B4%D0%B5%D0%BE-msRMMIzsMUc.html here is the video i made a couple of years ago about it... i'll send you a mail! thanks!
@@Josh.Davidson My heatgun has 2 settings, 350° and 550°, should be enough to melt quickly. I can preheat it evenly a bit with the 350° setting and them blast full power for a few seconds. Or I can preheat in the oven and then use the heatgun to quickly melt solder under the cpu, heating from behind. What do you think?
@@Josh.Davidson If I do it with the heatsink on and heat from the back that should be even better I think. Cause the die itself stays cooler than the solder. And I don't think the pcb would burn from that or warp, since I preheat
@@nomecognome5050 Friend, no. If you put heatsink then he will not reflow and just warp, and also if you do it that way, high chance you will damage it. No, the heatsinking of the groundplane will prevent melting without preheat. And if you have a pre-heat you should use hot air not heatgun.
@@Josh.Davidson What do you mean by "hot air"? The heatgun ... makes hot air. Yeah of course I'm gonna preheat first with the heatgun that makes hot air and just place the cpu heat spreader on the heatsink, not actually use the clamp. And heat from behind (pcb upsidedown resting on the heatsink)
