Soldering of 20 mil fine-pitch Quad Flat Pack 208 pin by John Gammell, Master IPC Trainer, Circuit Technology Inc. The Solder Training Authority. www.circuittechnology.com (919) 552-3434
Excelent work A plus,what temperature is the correct for this type of soldering? what type of flux you recomend? and just in case if a pad has thin already what tool you recomend to remove thin from the pads without risk of damage or lift?
whenever i do a SMD with pads so close together i always get solder connecting pads and have to run the wick to unclump them . How can i avoid that? BTW love your videos.
+Mem Baker - Finer pitch leads are easier to bridge. You have to use the correct tip. It must be well tinned and maintained. A small hoof type of tip and or an extended bent conical. Make a little solder bridge on the end 2-3 leads. Flux and reflow pulling the wet solder to the other leads. If you run out of solder create a small bridge there and the solder will follow the heat source once in reflow. Small bridges allow you to go lighter in solder than heavier. Solder wire should be no thicker than .015. The wick is a dangerous tool. It is very easy to pull mask leaving base metal conductor exposure where the trace connects to the pad and to induce thermal damage. Proper tools and technique will prevent the need for wick. I think I will do a video strictly on solder bridge removal next week.
Mem Baker - Next week I will upload a step by step video tutorial on bridge removal using the soldering tip and also the proper techniques for using desoldering wick.
