I am requesting a video on the topic of warpage in the thermal aspects of packaging. I found your previous video on this topic to be very informative and helpful. I am particularly interested in the topic of warpage, and I would be grateful if you could make a video on this topic in more detail. Warpage is a major concern in packaging, as it can lead to a number of problems, such as poor heat dissipation and reliability issues. I would be interested to learn more about the following: The causes of warpage How warpage can be measured and controlled The latest methods for mitigating the effects of warpage I believe that a video on this topic would be very valuable to students and engineers who are working in the field of packaging. I would be happy to provide any additional information that you may need.
Thanks for asking but I am not sure when I can make this. Before that let me try to answer briefly. 1. The causes of warpage - Warpage is from difference of CTE(Coefficient of Thermal Expansion) of materials. In package, Si has around 3ppm, substrate is around 17ppm, and mold compound is around 10~20ppm. All these materials with different CTE are combined and become one package. Then when this package is exposed to heat such as reflow temperature (max. 260℃) each material expand with different rate and shrink with different rate when cooling down. This difference of expansion and shrink make package warpage. 2. How warpage can be measured. - Shadow Moiré is the most popular method in the industry. Please check machine supplier's website for more detail. akrometrix.com/measurement-vision-technologies/ 3. How warpage can be controlled. The latest methods for mitigating the effects of warpage. - Typically warpage is controlled by using low CTE material. So material suppliers such as substrate, mod compound etc. are trying to find low CTE material to reduce package warpage. Another method is to reduce process temperature, for example reduce reflow temperature with low temperature melting solder ball, minimize exposing area for heat e.g. LAB(Laser Assist Bonding) for flipchip attach process which uses laser and focus only for bonding area instead of whole package.
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