[Eng Sub] PoP(Package on Package): Qualcomm, Apple, Samsung - MCeP, InFO, iPoP

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This video explains about Package on Package (PoP).
PoP is used for application processor (AP) of high-end smartphone like Apple iPhone, Samsung Galaxy.
There are 3 major structures.
- InFO: Fan Out package from TSMC for Apple A series AP in iPhone
- MCeP: Package using Copper Core Solder ball from Shinko for Qualcomm Snapdragon AP in Samsung Galaxy
- iPoP: Interposer PoP from Samsung for Samsung Exynos AP in Samsung Galaxy

Опубликовано:

19 сен 2024

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Комментарии : 15

@yisehakg5039 Год назад

Very informative and clear and even uptodate information. Thank you so much,

@semicontalk3223 Год назад

Thanks for watching!

@Parksheena123-vo9ls 4 месяца назад

There is another package in which RAM BGA200 is used. In this, all three RAM ROM processors are installed separately on the motherboard. Is this the fast??????? 😅

@semicontalk3223 4 месяца назад

I don't know about this so can't answer for your question.

@ethanlifethai 2 года назад

Thnaks fpr good information

@sadhana2187 3 года назад

Hi Sir, Could you please give one talk on chiplets vs PoP packaging.

@semicontalk3223 3 года назад

Thanks for comment. Sure, I already made a video about PoP so I will make one about chiplet.

@sadhana2187 3 года назад

@@semicontalk3223, Thanks a lot for your reply sir.

@Xiashangguan99 Год назад

Pop has better performance then other phone soc's??????

@semicontalk3223 Год назад

PoP(Package on Package) is a vertical package stack structure and bottom package has SoC die, typically application processor and top package has LPDDR memory dies. So it is not correct to compare PoP with SoC.

@Xiashangguan99 Год назад

@@semicontalk3223 sir i mean pop cpu phones are faster than soc powered phones??

@semicontalk3223 Год назад

Yes. Usually PoP is used for high-end smartphone and application processor in bottom package of PoP is the highest performance model. So smartphones using PoP are faster than other smartphone with these reasons.